MR107
更新时间:2024-09-18 22:19:53
品牌:TAIYO YUDEN
描述:Please read this notice before using the TAIYO YUDEN products
MR107 概述
Please read this notice before using the TAIYO YUDEN products
MR107 数据手册
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PDF下载Notice for TAIYO YUDEN productsꢀ
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
■ Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change
without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-
fore practical application or usage of the Products.
Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo-
rating such products, which are caused under the conditions other than those specified in this catalog or individual
specification.
■ Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is
available.
■ Please conduct validation and verification of products in actual condition of mounting and operating environment
before commercial shipment of the equipment.
■ All electronic components or functional modules listed in this catalog are developed, designed and intended for
use in general electronics equipment.(for AV, office automation, household, office supply, information service,
telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any
equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal,
disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have
direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance.
Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma-
rine system, military, etc. where higher safety and reliability are especially required.
In addition, even electronic components or functional modules that are used for the general electronic equipment,
if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliabil-
ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to
install a protective circuit is strongly recommended at customer's design stage.
■ The contents of this catalog are applicable to the products which are purchased from our sales offices or distribu-
tors (so called“TAIYO YUDEN’s official sales channel”).
It is only applicable to the products purchased from any of TAIYO YUDEN’s official sales channel.
■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc-
cur in connection with a third party's intellectual property rights and other related rights arising from your usage of
products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights.
■ Caution for export
Certain items in this catalog may require specific procedures for export according to“Foreign Exchange and For-
eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.
Should you have any question or inquiry on this matter, please contact our sales staff.
MULTILAYER CERAMIC CAPACITORS
WAVE
REFLOW
■PARTS NUMBER
△=Blank space
J
M
K
3
1
6
△
⑤
B
J
1
0
6
M
L
-
⑩
T
△
⑫
①
②
③
④
⑥
⑦
⑧
⑨
⑪
①Rated voltage
③End termination
Code
P
Rated voltage[VDC]
Code
K
End termination
2.5
4
Plated
A
R
High Reliability Application
J
6.3
10
④Dimension(L×W)
Type
L
Dimensions
E
16
EIA(inch)
(L×W)[mm]
0.4×0.2
T
25
042
063
01005
0201
0402
0204
0603
0306
0805
0508
1206
1210
1812
G
U
35
0.6×0.3
50
1.0×0.5
H
100
250
630
105
107
212
0.52×1.0 ※
1.6×0.8
Q
S
0.8×1.6 ※
2.0×1.25
1.25×2.0 ※
3.2×1.6
②Series name
Code
M
Series name
316
325
432
Multilayer ceramic capacitor
3.2×2.5
V
Multilayer ceramic capacitor for high frequency
LW reverse type multilayer capacitor
4.5×3.2
W
Note : ※LW reverse type(□WK) only
⑤Dimension tolerance
Code
△
Type
ALL
063
L[mm]
W[mm]
T[mm]
Standard
Standard
Standard
0.6±0.05
1.0±0.10
0.3±0.05
0.3±0.05
0.5±0.10
105
0.5±0.10
107
1.6+0.15/-0.05
0.8+0.15/-0.05
0.8+0.15/-0.05
0.45±0.05
A
212
2.0+0.15/-0.05
1.25+0.15/-0.05
1.25±0.20
0.85±0.10
1.25+0.15/-0.05
0.85±0.10
316
3.2±0.20
1.6±0.20
325
105
3.2±0.30
2.5±0.30
2.5±0.30
1.0+0.15/-0.05
0.5+0.15/-0.05
0.5+0.15/-0.05
0.45±0.05
107
212
1.6+0.20/-0
2.0+0.20/-0
0.8+0.20/-0
1.25+0.20/-0
0.8+0.20/-0
0.85±0.10
B
C
1.25+0.20/-0
1.6±0.30
316
105
3.2±0.30
1.6±0.30
1.0+0.20/-0
0.5+0.20/-0
0.5+0.20/-0
Note: P.6 Standard external dimensions
△= Blank space
⑥Temperature characteristics code
■High dielectric type(Excluding Super low distortion multilayer ceramic capacitor(CFCAPTM))
Applicable
standard
Temperature
range[℃]
Capacitance
tolerance
±10%
Tolerance
Code
Ref. Temp.[℃]
Capacitance change
±10%
code
K
JIS
B
-25~+ 85
-55~+ 85
-55~+125
-55~+105
-55~+125
-55~+ 85
20
25
25
25
25
25
±20%
M
BJ
±10%
K
EIA
EIA
EIA
EIA
EIA
X5R
X7R
X6S
X7S
X5R
±15%
±20%
M
±10%
K
B7
C6
±15%
±20%
M
±10%
K
±22%
±20%
M
±10%
K
C7
±22%
±20%
M
±10%
K
LD(※)
△F
±15%
±20%
M
JIS
EIA
F
-25~+ 85
-30~+ 85
20
25
+30/-80%
+22-82%
+80/-20%
+80/-20%
Z
Z
Y5V
Note : ※.LD Low distortion high value multilayer ceramic capacitor
△= Blank space
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
4
■Temperature compensating type
Applicable
Temperature
range[℃]
Capacitance
tolerance
±0.1pF
±0.25pF
±0.5pF
1pF
Tolerance
Code
Ref. Temp.[℃]
20
Capacitance change
0±60ppm/℃
standard
code
B
JIS
EIA
CH
C
D
CH
-55~+125
F
C0H
25
±5%
J
±10%
K
JIS
EIA
JIS
EIA
JIS
CJ
C0J
CK
20
25
20
25
20
CJ
CK
-55~+125
-55~+125
0±120ppm/℃
0±250ppm/℃
±0.25pF
±0.25pF
C
C
C0J
UJ
±0.25pF
±0.5pF
±5%
C
D
J
UJ
-55~+125
-750±120ppm/℃
EIA
U2J
25
JIS
EIA
JIS
UK
U2K
S
-55~+125
-55~+125
-55~+125
20
25
20
UK
SL
-750±250ppm/℃
±0.5pF
±5%
C
J
+350~-1000ppm/℃
⑥Series code
(Super low distortion multilayer ceramic capacitor(CFCAPTM)only)
⑨Thickness
Code
C
Thickness[mm]
0.2
Code
SD
Series code
Standard
D
P
T
K
V
W
A
D
F
0.2(Temperature compensating of 042type)
0.3
0.45
0.5
⑦Nominal capacitance
Code
Nominal capacitance
(example)
0R5
0.5pF
1pF
010
0.8
100
10pF
0.85(212type or more)
101
100p
1.15
1.25
1.5
102
1,000pF
10,000pF
0.1μF
1.0μF
10μF
100μF
G
H
L
103
104
1.6
105
N
Y
M
1.9
106
2.0 max
2.5
107
Note : R=Decimal point
⑩Special code
⑧Capacitance tolerance
Code
-
Special code
Standard
Code
B
Capacitance tolerance
±0.1pF
MLCC for Industrial, Automotive Comfort
and Safety
H
C
±0.25pF
±0.5pF
D
F
±1pF
⑪Packaging
J
±5%
Code
Packaging
K
±10%
F
T
φ178mm Taping (2mm pitch)
M
Z
±20%
φ178mm Taping (4mm pitch)
+80/-20%
φ178mm Taping (4mm pitch, 1000 pcs/reel)
325 type(Thickness code M)
P
W
φ178mm Taping(1mm pitch)042type only
⑫Internal code
Code
△
Internal code
Standard
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
5
■STANDARD EXTERNAL DIMENSIONS
Dimension [mm]
T
Type( EIA )
□MK042(01005)
□MK063(0201)
L
W
*1
C
D
P
T
e
0.4±0.02
0.2±0.02
0.2±0.02
0.3±0.03
0.1±0.03
0.6±0.03
1.0±0.05
0.3±0.03
0.5±0.05
0.15±0.05
0.25±0.10
0.2±0.02
0.3±0.03
0.5±0.05
0.5±0.05
0.3±0.05
0.45±0.05
0.8±0.10
0.8±0.10
0.5±0.05
0.45±0.05
0.85±0.10
1.25±0.10
1.25±0.10
0.85±0.1
0.85±0.10
1.15±0.10
1.25±0.10
1.6±0.20
1.6±0.20
0.85±0.10
1.15±0.10
1.5±0.10
1.9±0.20
1.9+0.1/-0.2
2.5±0.20
1.9±0.20
2.5±0.20
2.5±0.20
C
P
V
W
P
K
□MK105(0402)
□VK105(0402)
1.0±0.05
0.5±0.05
1.0±0.05
0.25±0.10
0.18±0.08
□WK105(0204)※
0.52±0.05
□MK107(0603)
1.6±0.10
0.8±0.10
0.35±0.25
A
A
V
K
□MR107(0603)
1.6±0.10
0.8±0.10
0.8±0.10
1.6±0.10
0.1~0.6
□WK107(0306)※
0.25±0.15
e
□MK212(0805)
2.0±0.10
1.25±0.10
D
G
G
D
D
F
G
L
0.5±0.25
※ LW reverse type
□MR212(0805)
2.0±0.10
1.25±0.10
2.0±0.15
0.25~0.75
0.3±0.2
□WK212(0508)※
1.25±0.15
□MK316(1206)
□MR316(1206)
3.2±0.15
3.2±0.15
1.6±0.15
1.6±0.15
0.5+0.35/-0.25
0.25~0.85
L
D
F
H
N
Y
□MK325(1210)
3.2±0.30
2.5±0.20
0.6±0.3
M
N
M
M
□MR325(1210)
□MK432(1812)
3.2±0.30
4.5±0.40
2.5±0.20
3.2±0.30
0.3~0.9
0.9±0.6
Note : ※. LW reverse type, *1.Thickness code
■STANDARD QUANTITY
Dimension
Standard quantity[pcs]
Type
042
EIA(inch)
01005
[mm]
0.2
Code
C
D
P
Paper tape
Embossed tape
-
40000
063
0201
0402
0.3
15000
-
T
0.2
0.3
C
P
20000
15000
-
-
105
V
W
P
0.5
10000
-
0204 ※
0603
0.30
0.45
0.8
K
4000
-
-
4000
-
107
212
A
V
K
0306 ※
0.50
0.45
0.85
1.25
0.85
0.85
1.15
1.25
1.6
4000
0805
D
G
D
D
F
-
3000
-
0508 ※
4000
4000
-
316
1206
-
-
3000
2000
G
L
0.85
1.15
1.5
D
F
H
N
Y
-
2000
325
432
1210
1812
1.9
2.0 max
2.5
M
M
-
-
500(T),1000(P)
500
2.5
Note : ※.LW Reverse type(□WK)
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspecification.ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
ꢀ
6
Multilayer Ceramic Capacitors
■PACKAGING
①Minimum Quantity
●Taped package
Thickness
Standard quantity [pcs]
Type(EIA)
mm
0.2
code
C, D
P, T
P
Paper tape
Embossed tape
40000
□MK042(01005)
□MK063(0201)
-
0.3
15000
10000
20000
15000
□WK105(0204) ※
0.3
0.2
C
□MK105(0402)
0.3
P
-
0.5
V
10000
□VK105(0402) ※
□MK107(0603)
0.5
W
K
0.45
0.5
4000
-
□WK107(0306) ※
□MR107(0603)
V
4000
-
0.8
A
0.45
0.85
1.25
0.85
1.15
1.25
1.6
K
4000
□MK212(0805)
□WK212(0508)
□MR212(0805)
※
D
G
-
3000
-
D
4000
F
□MK316(1206)
□MR316(1206)
3000
G
-
L
0.85
1.15
1.5
D
F
2000
H
□MK325(1210)
□MR325(1210)
-
-
1.9
N
2.0max.
2.5
Y
M
M
500(T), 1000(P)
500
□MK432(1812)
2.5
Note : ※ LW Reverse type.
②Taping material
※No bottom tape for pressed carrier tape
●Card board carrier tape
●Embossed tape
Chip filled
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
③Representative taping dimensions
●Paper Tape(8mm wide)
●Pressed carrier tape( 2mm pitch)
Chip Cavity
Insertion Pitch
F
Tape Thicknes
Type(EIA)
A
B
T
T1
□MK063(0201)
0.37
0.67
0.45max.
0.42max.
□WK105(0204) ※
□MK105(0402) (*1 C)
□MK105(0402) (*1 P)
2.0±0.05
0.65
1.15
0.4max.
0.3max.
0.42max.
Unit:mm
0.45max.
Note *1 Thickness, C:0.2mm ,P:0.3mm. ※ LW Reverse type.
●Punched carrier tape (2mm pitch)
Chip Cavity
Type(EIA)
Insertion Pitch
F
Tape Thickness
T
A
B
□MK105 (0402)
□VK105 (0402)
0.65
1.15
2.0±0.05
0.8max.
Unit:mm
●Punched carrier tape (4mm pitch)
Chip Cavity
Insertion Pich
F
Tape Thickness
T
Type(EIA)
A
B
□MK107(0603)
□WK107(0306)
□MR107(0603)
□MK212(0805)
□WK212(0508)
□MK316(1206)
※
※
1.0
1.8
1.1max.
4.0±0.1
1.65
2.0
2.4
3.6
1.1max.
Note:Taping size might be different depending on the size of the product. ※ LW Reverse type.
Unit:mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
●Embossed tape(4mm wide)
Chp Cavity
Insertion Pitch
F
Tape Thickness
Type(EIA)
A
B
K
T
□MK042(01005)
0.23
0.43
1.0±0.02
0.5max.
0.25max.
Unit:mm
●Embossed tape(8mm wide)
Chip Cavity
Insertion Pitch
F
Tape Thickness
Type(EIA)
A
B
K
T
□WK107(0306) ※
□MK212(0805)
1.0
1.8
1.3max.
0.25±0.1
1.65
2.0
2.4
3.6
3.6
□MR212(0805)
4.0±0.1
□MK316(1206)
3.4max.
0.6max.
□MR316(1206)
□MK325(1210)
2.8
□MR325(1210)
Note: ※ LW Reverse type.
Unit:mm
●Embossed tape(12mm wide)
Chip Cavity
Insertion Pitch
Tape Thickness
Type(EIA)
A
B
F
K
T
□MK432(1812)
3.7
4.9
8.0±0.1
4.0max.
0.6max.
Unit:mm
④Trailer and Leader
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
⑤Reel size
A
B
C
D
E
R
φ178±2.0
φ50min.
φ13.0±0.2
φ21.0±0.8
2.0±0.5
1.0
T
W
4mm wide tape
8mm wide tape
12mm wide tape
1.5max.
2.5max.
2.5max.
5±1.0
10±1.5
14±1.5
Unit:mm
⑥Top Tape Strength
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.
⑦Bulk Cassette
The exchange of individual specification is necessary.
Please contact Taiyo Yuden sales channels.
Unit:mm
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_pack01_j-02
Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Multilayer Ceramic Capacitors
■RELIABILITY DATA
1.Operating Temperature Range
Standard
Temperature
-55 to +125℃
Compensating(Class1)
High Frequency Type
Specification
Temperature Range
-25 to +85℃
-55 to +85℃
-55 to +125℃
-55 to +105℃
-55 to +125℃
-55 to +85℃
-25 to +85℃
-30 to +85℃
B
BJ
X5R
X7R
X6S
X7S
X5R
F
Specified
Value
B7
C6
High Permittivity (Class2)
C7
LD(※)
F
Y5V
Note: ※LD Low distortion high value multilayer ceramic capacitor
2. Storage Conditions
Temperature
Standard
-55 to +125℃
Compensating(Class1)
High Frequency Type
Specification
Temperature Range
-25 to +85℃
-55 to +85℃
-55 to +125℃
-55 to +105℃
-55 to +125℃
-55 to +85℃
-25 to +85℃
-30 to +85℃
B
BJ
X5R
X7R
X6S
X7S
X5R
F
Specified
Value
B7
C6
High Permittivity (Class2)
C7
LD(※)
F
Y5V
Note: ※LD Low distortion high value multilayer ceramic capacitor
3. Rated Voltage
Standard
50VDC, 25VDC, 16VDC
Temperature
Specified
Value
Compensating(Class1)
High Frequency Type 50VDC, 16VDC
50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC
High Permittivity (Class2)
4. Withstanding Voltage (Between terminals)
Temperature
Specified
Standard
Compensating(Class1)
High Frequency Type No breakdown or damage
Value
High Permittivity (Class2)
Class 1
Class 2
Rated voltage×2.5
Test
Applied voltage
Methods and
Duration
Rated volta×3
1 to 5 sec.
50mA max.
Remarks
Charge/discharge current
5. Insulation Resistance
Temperature
Standard
High Frequency Type
10000 MΩ min.
Compensating(Class1)
Specified
Value
C≦0.047μF : 10000 MΩ min.
C>0.047μF : 500MΩ・μF
High Permittivity (Class2) Note 1
Test
Applied voltage
Duration
: Rated voltage
Methods and
Remarks
: 60±5 sec.
: 50mA max.
Charge/discharge current
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
6. Capacitance (Tolerance)
Temperature
0.2pF≦C≦5pF
0.2pF≦C≦10pF
C>10pF
: ±0.25pF
C□
U□
SL
Standard
: ±0.5pF
: ±5% or ±10%
Compensating(Class1)
Specified
Value
0.3pF≦C≦2pF
C>2pF
: ±0.1pF
: ±5%
CH
RH
High Frequency Type
BJ, B7, C6, C7, LD(※) : ±10% or ±20%,
F : +80/-20%
High Permittivity (Class2)
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
Class 2
Standard
C≦10μF
C>10μF
Test
Preconditioning
None
Thermal treatment (at 150℃ for 1hr) Note 2
Methods and
Remarks
Measuring frequency
Measuring voltage Note
Bias application
1MHz±10%
0.5 to 5Vrms
1kHz±10%
1±0.2Vrms
120±10Hz
0.5±0.1rms
one
7. Q or Dissipation Factor
C<30pF : Q≧400+20C
C≧30pF : Q≧1000
Standard
Temperature
Compensating(Class1)
(C:Nominal capacitance)
Specified
Value
High Frequency Type Refer to detailed specification
High Permittivity (Class2) Note 1
BJ, B7, C6, C7:2.5% max., F:7% max.
Class 1
Class 2
Standard
High Frequency Type
C≦10μF
C>10μF
Preconditioning
None
Thermal treatment (at 150℃ for 1hr) Note 2
Test
Measuring frequey
Measuring voltage Note 1
Bias application
1MHz±10%
1GHz
1kHz±10%
1±0.2Vrms
120±10Hz
Methods and
Remarks
0.5 to 5Vrms
0.5±0.1Vrms
None
High Frequency Type
Measuring equipment
Measuring jig
: HP4291A
: HP16192A
8. Temperature Characteristic (Without voltage application)
Temperature Characteristic [ppm/℃]
Tolerance [ppm/℃]
C□ :
0
CH, CJ, CK
H : ±60
J : ±120
K : ±250
Standard
U□ : -750
UJ, UK
Temperature
SL : +350 to -1000
Compensating(Class1)
Temperature Characteristic [ppm/℃]
Tolerance [ppm/℃]
H : ±60
High Frequency Type
C□ :
0
CH
RH
R□ : -220
Capacitance
change
Reference
Specified
Value
Specification
Temperature Range
temperature
20℃
B
±10%
-25 to +85℃
-55 to +85℃
-55 to +125℃
-55 to +105℃
-55 to +125℃
-55 to +85℃
-25 to +85℃
-30 to +85℃
BJ
X5R
X7R
X6S
X7S
X5R
F
±15%
25℃
B7
C6
±15%
25℃
High Permittivity (Class2)
±22%
25℃
C7
±22%
25℃
LD(※)
±15%
25℃
+30/-80%
+22/-82%
20℃
F
Y5V
25℃
Note : ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the
following equation.
(C85-C20)
×106(ppm/℃)
C20×△T
△T=65
Test
Class 2
Methods and
Remarks
Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following
equation.
Step
B、F
X5R、X7R、X6S、X7S、Y5V
Minimum operating temperature
1
2
3
20℃
25℃
Maximum operating temperature
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
(C-C2)
C2
×100(%)
C
:Capacitance in Step 1 or Step 3
C2 :Capacitance in Step 2
9. Deflection
Appearance
: No abnormality
Standard
Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.
Temperature
Compensating(Class1)
Appearance
: No abnormality
: Within±0.5 pF
High Frequency Type
Specified
Value
Cpaitance change
Appearance
: No abnormality
Capacitance change : Within ±12.5%(BJ, B7, C6, C7,LD(※))
Within ±30%(F)
High Permittivity (Class2)
Note: ※LD Low distortion high value multilayer ceramic capacitor
Multilayer Ceramic Capacitors
042, 063, ※105 Type
The other types
Board
Glass epoxy-resin substrate
Test
Thickness
Warp
0.8mm
1.6mm
Methods and
Remarks
1mm
Duration
10 sec.
※105 Type thickness, C: 0.2mm ,P: 0.3mm.
Capacitance measurement shall be conducted
with the board bent
10. Body Strength
Standard
-
Temperature
Specified
Value
Compensating(Class1)
High Frequency Type No mechanical damage.
-
High Permittivity (Class2)
High Frequency Type
Applied force
Duration
: 5N
Test
: 10 sec.
Methods and
Remarks
11. Adhesive Strength of Terminal Electrodes
Temperature
Standard
Specified
Compensating(Class1)
High Frequency Type No terminal separation or its indication.
Value
High Permittivity (Class2)
Multilayer Ceramic Capacitors
042, 063 Type
2N
105 Type or more
5N
Test
Methods and
Remarks
Applied force
Duration
30±5 sec.
12. Solderability
Standard
High Frequency Type At least 95% of terminal electrode is covered by new solder.
Temperature
Specified
Value
Compensating(Class1)
High Permittivity (Class2)
Eutectic solder
H60A or H63A
230±5℃
Lead-free solder
Sn-3.0Ag-0.5Cu
245±3℃
Test
Solder type
Methods and
Remarks
Solder temperature
Duration
4±1 sec.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
13. Resistance to Soldering
Appearance
: No abnormlty
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
(between terminals) : No abnormality
Temperature
Compensating(Class1)
Appearance
: No abnormality
Capacitancecange
Q
: Within ±2.5%
: Initial value
High Frequency Type
Specified
Value
Insulation resistance
Withstanding voltage
: Initial value
(between terminals) : No abnormality
Appearance
: No abnormality
Capactace change
: Within ±7.5%(BJ, B7, C6, C7, LD(※))
Within ±20%(F)
High Permittivity (Class2) Note 1
Dissipation factor
: Initial value
Insulation resistance
Withstanding voltage
: Initial value
(between terminals): No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
lss 1
042, 063 Type
105 Type
Preconditioning
Preheating
None
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
270±5℃
150℃, 1 to 2 min.
Solder temp.
Duration
3±0.5 sec.
Recovery
6 to 24 hrs (Standard condition) Noe 5
Test
Methods and
Remarks
Class 2
105, 107, 212 Type
042、063 Type
316, 325 Type
Preconditioning
Preheating
Thermal treatment (at 150℃ for 1 hr) Note 2
80 to 100℃, 2 to 5 min.
150 to 200℃, 2 to 5 min.
270±5℃
80 to 100℃, 5 to 10 min.
150 to 200℃, 5 to 10 min.
150℃, 1 to 2 min.
Solder temp.
Duration
3±0.5 sec.
Recovery
24±2 hrs (Standard condition) Note 5
14. Temperature Cycle (Thermal Shock)
Appearance
: No abnormality
Capacitance change
Q
: Within ±2.5% or ±0.25pF, whichever is larger.
: Initial value
Standard
Insulation resistance
Withstanding voltage
: Initial value
(between terminals) : No abnormality
Temperature
Compensating(Class1)
Appearance
: No abnormality
Capacitance change
Q
: Within ±0.25pF
: Initial value
High Frequency Type
Specified
Value
Insulation resistance
Withstanding voltage
: Initial value
(between terminals) : No abnormality
Appearance
: No abnormality
Capacitance change
: Within ±7.5% (BJ, B7, C6, C7, LD(※))
Within ±20% (F)
High Permittivity (Class2) Note 1
Dissipation factor
: Initial value
Insulation resistance
Withstanding voltage
: Initial value
(between terminals) : No abnormality
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
None
Class 2
Thermal treatment (at 150℃ for 1 hr)
Note 2
Preconditioning
Step
Temperature(℃)
Time(min.)
Test
1
2
3
4
Minimum operating temperature
Normal temperature
30±3
2 to 3
30±3
2 to 3
Methods and
Remarks
1 cycle
Maximum operating temperature
Normal temperature
Number of cycles
Recovery
5 times
6 to 24 hrs (Standard condition) Note 5
24±2 hrs (Standard condition) Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
15. Humidity (Steady State)
Appearance
: No abnormality
Capacitance change
Q
: Within ±5% or ±0.5pF, whichever is larger.
: C<10pF : Q≧200+10C
Standard
10≦C<30pF : Q≧275+2.5C
C≧30pF:Q≧350(C:Nominal capacitance)
: 1000 MΩ min.
Temperature
Compensating(Class1)
Insulation resistance
Appearance
: No abnormality
: Within ±0.5pF,
: 1000 MΩ min.
Specified
Value
High Frequency Type Capacitance change
Insulation resistance
Appearance
: No abnormality
Capacitance change
: Within ±12.5% (BJ, B7, C6, C7, LD(※))
Within ±30% (F)
High Permittivity (Class2) Note 1
Dissipation factor
: 5.0% max.(BJ, B7, C6, C7, LD(※))
11.0% max.(F)
Insulation resistance
: 50 MΩμF or 1000 MΩ whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Class 2
All items
Standard
40±2℃
High Frequency Type
60±2℃
Preconditioning
Temperature
Humidity
None
Thermal treatment( at 150℃ for 1 hr) Note 2
40±2℃
Test
Methods and
Remarks
90 to 95%RH
90 to 95%RH
Duration
500+24/-0 hrs
500+24/-0 hrs
Recovery
6 to 24 hrs (Standard condition) Note 5
24±2 hrs (Standard condition) Note 5
16. Humidity Loading
Appearance
: No abnormality
Capacitance change
: Within ±7.5% or ±0.75pF, whichever is larger.
: C<30pF:Q≧100+10C/3
Standard
Q
C≧30pF:Q≧200 (C:Nominal capacitance)
: 500 MΩ min.
Insulation resistance
Temperature
Compensating(Class1)
Appearance
: No abnormality
Capacitance change
: C≦2pF:Within ±0.4 pF
C>2pF:Within ±0.75 pF
(C:Nominal capacitance)
: 500 MΩ min.
High Frequency Type
Specified
Value
Insulation resistance
Appearance
: No abnormality
Capacitance change
: Within ±12.5% (BJ, B7, C6, C7, LD(※))
Within ±30% (F)
High Permittivity (Class2) Note 1
Dissipation factor
: 5.0% max. (BJ, B7, C6, C7, LD(※))
11.0% max. (F)
Insulation resistance
: 25 MΩμF or 500 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
Class 2
Standard
High Frequency Type
All items
Preconditioning
Voltage treatment
None
(Rated voltage are applied for 1 hour at 40℃) Note 3
Temperature
Humidity
40±2℃
60±2℃
40±2℃
Test
Methods and
Remarks
90 to 95%RH
500+24/-0 hrs
Rated voltage
90 to 95%RH
Duration
500+24/-0 hrs
Rated voltage
Applied voltage
Charge/discharge
current
50mA max.
50mA max.
Recovery
6 to 24 hrs (Standard condition) Note 5
24±2 hrs(Standard condition) Note 5
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
17. High Temperature Loading
Appearance
: No abnormality
Capacitance change
Q
: Within ±3% or ±0.3pF, whichever is larger.
: C<10pF: Q≧200+10C
Standard
10≦C<30pF:Q≧275+2.5C
C≧30pF: Q≧350(C:Nominal capacitance)
: 1000 MΩ min.
Temperature
Compensating(Class1)
Insulation resistance
Appearance
: No abnormality
Specified
Value
High Frequency Type Capacitance change
Insulation resistance
: Within ±3% or ±0.3pF, whichever is larger.
: 1000 MΩ min.
Appearance
: No abnormality
Capacitance change
: Within ±12.5% (BJ, B7, C6, C7, LD(※))
Within ±30% (F)
High Permittivity (Class2) Note 1
Dissipation factor
: 5.0% max.(BJ, B7, C6, C7, LD(※))
11.0% max.(F)
Insulation resistance
: 50 MΩμF or 1000 MΩ, whichever is smaller.
Note: ※LD Low distortion high value multilayer ceramic capacitor
Class 1
High Frequency Type
Class 2
C6
Standard
BJ, LD(※), F
B7, C7
Voltage treatment(Twice the rated voltage shall be applied for
1 hour at 85℃, 105℃ or 125℃) Note 3, 4
Maximum operating temperature
Preconditioning
None
Temperature
Duration
Maximum operating temperature
1000+48/-0 hrs
Test
1000+48/-0 hrs
Methods and
Remarks
Applied voltage
Charge/discharge
current
Rated voltage×2
Rated voltage×2 Note 4
50mA max.
50mA max.
Recovery
6 to 24hr (Standard condition) Note 5
24±2 hrs (Standard condition) Note 5
Note: ※LD Low distortion high value multilayer ceramic capacitor
Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.
Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150+0/-10℃ for an hour and kept at room temperature for
24±2hours.
Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in
the test conditions, and kept at room temperature for 24±2hours.
Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.
Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning
measurement results, in order to provide correlation data, the test shall be conducted under the following condition.
Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the
"standard condition".
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_reli_e-01
High Reliability Application Multilayer Ceramic Capacitors are noted separately.
Precautions on the use of Multilayer Ceramic Capacitors
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have
severe social ramifications.
Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from
them used in general purpose applications.
Precautions
◆Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be their rated voltage or less.
If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.
For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.
2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC
voltage or a pulse voltage having rapid rise time is used in a circuit.
2. PCB Design
◆Pattern configurations (Design of Land-patterns)
1. When capacitors are mounted on PCBs, the amount of solder used (size of fillet) can directly affect the capacitor performance.
Therefore, the following items must be carefully considered in the design of land patterns:
(1)Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider
appropriate land-patterns for proper amount of solder.
Precautions
(2)When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by
solder-resist.
◆Pattern configurations (Capacitor layout on PCBs)
After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes (PCB
cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.). For this reason, land
pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.
◆Pattern configurations (Design of Land-patterns)
The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.
(1)Recommended land dimensions for typical chip capacitors
●Multilayer Ceramic Capacitors : Recommended land dimensions
Land patterns for PCBs
(unit: mm)
Wave-soldering
Type
107
1.6
212
2.0
316
3.2
325
3.2
L
Size
W
0.8
1.25
1.6
2.5
A
B
C
0.8 to 1.0
0.5 to 0.8
0.6 to 0.8
1.0 to 1.4
0.8 to 1.5
0.9 to 1.2
1.8 to 2.5
0.8 to 1.7
1.2 to 1.6
1.8 to 2.5
0.8 to 1.7
1.8 to 2.5
Reflow-soldering
Type 042
063
0.6
105
1.0
107
1.6
0.8
212
2.0
316
3.2
325
3.2
432
Technical
L
0.4
4.5
Size
considerations
W
0.2
0.3
0.5
1.25
1.6
2.5
3.2
A
B
C
0.15 to 0.25
0.15 to 0.20
0.15 to 0.30
0.20 to 0.30
0.20 to 0.30
0.25 to 0.40
0.45 to 0.55
0.40 to 0.50
0.45 to 0.55
0.8 to 1.0
0.8 to 1.2
0.8 to 1.2
0.9 to 1.6
1.8 to 2.5
1.0 to 1.5
1.2 to 2.0
1.8 to 2.5
1.0 to 1.5
1.8 to 3.2
2.5 to 3.5
1.5 to 1.8
2.3 to 3.5
0.6 to 0.8
0.6 to 0.8
Note:Recommended land size might be different according to the allowance of the size of the product.
●LWDC: Recommended land dimensions for reflow-soldering
(unit: mm)
Type
105
0.52
107
0.8
212
1.25
L
Size
W
1.0
1.6
2.0
A
B
C
0.18 to 0.22
0.2 to 0.25
0.9 to 1.1
0.25 to 0.3
0.3 to 0.4
1.5 to 1.7
0.5 to 0.7
0.4 to 0.5
1.9 to 2.1
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
(2)Examples of good and bad solder application
Items
Not eommended
Recommended
Mixed mounting of SMD and
leaded components
Component placement close to
the chassis
Hand-soldering of leaded
Components near mounted
components
Horizontal component
placement
◆Pattern configurations (Capacitor layout on PCBs)
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
Deflection of board
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
Precautions
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
Technical
(1)The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
(2)The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
considerations
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
Items
Not recommended
Recommended
Single-sided mounting
Double-sided mounting
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
(1)Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
(2)The recommended amount of adhesives is as follows;
[Recommended condition]
Amount adhesive
After capacitors are bonded
Figure
212/316 case sizes as examples
a
b
c
0.3mm min
100 to 120μm
Adhesives shall not contact land
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
(1)Flux used shall be less than or equal to 0.1 wt%( in Cl equivalent) of halogenated content. Flux having a strong acidity content shall
not be applied.
(2)When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
(3)When water-soluble flux is used, special care shall be taken to properly clean the boards.
Precautions
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance(Chlorine, etc.) content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
Technical
considerations
◆Soldering
・ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
・ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
・ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
・ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
[Reflow soldering]
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①The ideal condition is to have solder mass(fillet)controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
[Wave soldering]
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
[Hand soldering]
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
⊿T
⊿T
325type or more
⊿T≦130℃
316type or less
⊿T≦150℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
Precautions
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
of the cleaning. (e.g. to remove soldering flux or other materials from the production process.)
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions( insufficient or excessive cleaning) may adversely affect the performance of
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead
the capacitors.
to the
Technical
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
considerations
Ultrasonic output :
20 W/ℓ or less
40 kHz or less
Ultrasonic frequency :
Ultrasonic washing period : 5 min. or less
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
6. Resin coating and mold
1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the
while left under normal storage conditions resulting in the deterioration of the capacitor's performance.
hardening period or
Precautions
2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat
may lead to damage or destruction of capacitors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Splitting of PCB
1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.
2. Board separation shall not be done manually, but by using the appropriate devices.
Precautions
◆Mechanical considerations
Be careful not to subject capacitors to excessive mechanical shocks.
(1)If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.
(2)Please be careful that the mounted components do not come in contact with or bump against other boards or
components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Ambient temperature : Below 30℃
Humidity
: Below 70% RH
Precautions
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as
time passes, so capacitors shall be used within 6 months from the time of delivery.
・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.
2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so
care shall be
taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at
150℃ for 1hour.
If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and
quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the
above period, please check solderability before using the capacitors.
Technical
considerations
※RCR-2335B(Safety Application Guide for fixed ceramic capacitors for use in electronic equipment)is published by JEITA.
Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-01
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